Muhammad AdnanEngineering & designIdeas engineered. Solutions delivered.

Electronics & Embedded

Engineering project

10-Layer High-Speed Data Acquisition PCB

10-layer high-speed PCB for a 1GSPS data acquisition system with DDR4, PCIe Gen 3, and Xilinx FPGA.

PCBDDR4PCIe Gen 3Signal Integrity
10-Layer High-Speed Data Acquisition PCB — engineering scope diagram Enlarge image
Project-specific scope and deliverables, illustrated from the engineering brief.
10-Layer High-Speed Data Acquisition PCB — architecture diagram Enlarge image
Explanatory system architecture: inputs, engineering model and outputs.
10-Layer High-Speed Data Acquisition PCB — workflow diagram Enlarge image
Explanatory workflow for the engineering analysis and validation process.

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Project brief

A complex 10-layer hybrid PCB (Rogers 4350B + FR4) for a high-speed data acquisition board. The design features DDR4-3200 memory interface using fly-by topology with optimized trace length matching, PCIe Gen 3 ×4 at 8Gbps per lane with AC coupling and controlled differential impedance, JESD204B ADC interface at 1GSPS, and a Xilinx UltraScale FPGA as the central processing element.

The scope emphasizes layout discipline, interface planning, and analysis for a high-speed acquisition board. No new eye diagrams or measured margins are asserted.

The engineering challenge

Route high-speed digital, RF, and power functions within a complex multilayer board stackup.

Engineering approach

  1. Define interface routing constraints and return-path continuity.
  2. Coordinate memory, converter, and host-link placement around the FPGA.
  3. Use the stated signal- and power-integrity analyses to review layout choices.

Features & capabilities

  • DDR4-3200 interface: fly-by topology, 20-mil trace matching, T-routing
  • PCIe Gen 3 ×4 at 8Gbps: 100Ω differential, AC coupling, reference spreading
  • JESD204B subclass 1: 12-bit, 1GSPS ADC (LTC2158-14) interface
  • Controlled impedance: 50Ω SE ±10%, 100Ω differential ±10%
  • 12 independent power domains with PDN analysis and decoupling optimization
  • Ansys SIwave SI/PI analysis — pre and post-layout correlation
  • 4-layer ground plane arrangement for minimal loop inductance
  • Via-in-pad with back-drilling for signal integrity at >5GHz frequencies

Software & engineering tools

Altium Designer 23, Ansys SIwave, Rogers 4350B + FR4 stackup, 10-layer (1oz/oz/0.5oz), Xilinx UltraScale+, LTC2158

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